SEMICONDUCTOR DEVICE CIRCUIT PACKAGE

Brand	Owner (click to sort)	Address	Description
BOC	TEXAS INSTRUMENTS INCORPORATED	12500 TI Boulevard, MS 3999 Dallas TX 752434136	semiconductor device circuit package;
BOC-BGA	Micron Technology, Inc.	8000 South Federal Way Boise ID 83707	Semiconductor device circuit package;
BOC-CSP	TEXAS INSTRUMENTS INCORPORATED	12500 TI Boulevard, MS 3999 Dallas TX 752434136	Semiconductor device circuit package;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.