SEMICONDUCTOR CHIPS INTEGRATED CIRCUITS

Brand Owner (click to sort) Address Description
DALLAS MAXIM INTEGRATED PRODUCTS, INC. 160 Rio Robles San Jose CA 95134 SEMICONDUCTOR CHIPS AND INTEGRATED CIRCUITS;
DALLAS SEMICONDUCTOR MAXIM INTEGRATED PRODUCTS, INC. 160 Rio Robles San Jose CA 95134 SEMICONDUCTOR CHIPS AND INTEGRATED CIRCUITS;SEMICONDUCTOR;
IMI CYPRESS SEMICONDUCTOR CORPORATION 198 Champion Court San Jose CA 95134 semiconductor chips and integrated circuits;
INREVIUM TOKYO ELECTRON DEVICE LIMITED 1-4, Kinko-cho, Kanagawa-ku, Yokohama City Kanagawa 221-0056 Japan Semiconductor chips and integrated circuits; electronic circuit boards and electronic components, namely printed circuit boards and gate arrays; downloadable electronic publications, namely manuals featuring specifications of semiconductor chips or electronic circuit boards recorded on computer media and instructions on manufacturing printed circuit boards and semiconductor chips recorded on computer media; computer programs, namely, downloadable software to use with semiconductor chips or electronic circuit boards for the acquisition, detection, input, output, storage, conversion, transfer and transmission of electronic data; electronic integrated circuits, prerecorded magnetic compact disks, magnetic video tapes and CD-ROMs featuring computer programs for designing semiconductors for use in manufacturing semiconductors;Providing information on sales of computers and computer program software; providing information on sales of goods by computers or via the Internet;Design of electronic circuit boards and integrated circuits for others; technical consultation and expertise in the field of electronic circuit boards and integrated circuit designs; technical consultation for others in the field of computer programming;
INREVIUM TOKYO ELECTRON DEVICE LIMITED 1-4, Kinko-cho, Kanagawa-ku, Yokohama City Kanagawa 221-0056 Japan Semiconductor chips and integrated circuits; electronic circuit boards and electronic components, namely, printed circuit boards and parts thereof; computer programs, namely, downloadable software or recorded software to use with semiconductor chips or electronic circuit boards for the acquisition, detection, input, output, storage, conversion, transfer and transmission of electronic data; downloadable electronic publications, namely, manuals featuring specifications of semiconductor chips or electronic circuit boards recorded on computer media and instructions on manufacturing printed circuit boards and semiconductor chips recorded on computer media;The color red appears in the lettering INREVIUM.;The color(s) red is/are claimed as a feature of the mark.;Providing information on commodity sales;The wording INREVIUM has no meaning in a foreign language.;Computer software design and computer programming for others; technical consultation for others in the fields of computer software design and computer programming; design of machines, apparatus, instruments and their parts or systems composed of such machines, apparatus, instruments and their parts for others; technical consultation for others in the fields of design of machines, apparatus, instruments and their parts or design of systems composed of such machines, apparatus, instruments and their parts;
MAXIM MAXIM INTEGRATED PRODUCTS, INC. 160 Rio Robles San Jose CA 95134 Semiconductor Chips and Integrated Circuits;IN THE STATEMENT, COLUMN 1, LINE 1, MAXIM INTEGRATED PRODUCTS SHOULD BE DELETED AND MAXIM INTEGRATED PRODUCTS, INC. SHOULD BE INSERTED.;
OTUFLEX Applied Micro Circuits Corporation Legal Department 215 Moffett Park Drive Sunnyvale, CA 94089 Semiconductor chips and integrated circuits for use in optical transport networking devices and equipment;
PLP J-DEVICES CORPORATION 1913-2 Fukura Usuki-City Oita875-0 Japan Semiconductor chips and integrated circuits;
VOXEL Uhnder, Inc. 3409 Executive Center Drive, Suite 205 Austin TX 78731 Semiconductor chips and integrated circuits for use in radar applications;
VOXEL ROC Uhnder, Inc. 3409 Executive Center Drive, Suite 205 Austin TX 78731 Semiconductor chips and integrated circuits for use in radar applications;ROC;
XEMOS XEMOD INCORPORATED 1026 West Maude Avenue #305 Sunnyvale CA 94086 Semiconductor chips and integrated circuits which facilitate radio frequency (RF) power functions;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A groove is formed on a semiconductor substrate having integrated circuits and electrodes from a first surface. An insulating layer is formed on an inner surface of the groove. A conductive layer is formed on the insulating layer above the inner surface of the groove. A second surface of the semiconductor substrate opposite to the first surface is ground until the groove is exposed to divide the semiconductor substrate into a plurality of semiconductor chips in which the conductive layer is exposed on a side surface of each semiconductor chip. The semiconductor chips are then stacked. The conductive layer of one of the semiconductor chips is electrically connected to the conductive layer of another one of the semiconductor chips.