SEMICONDUCTOR CARRIER COMBINATION

Brand Owner (click to sort) Address Description
MODULE READY TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 semiconductor and carrier in combination; circuit boards; circuit board layers; computer chips; semiconductor carriers; chip carriers; and electronic signal processing units; namely, computer signal processing units, high definition television signal processing units and telecommunication signal processing units;MODULE;
µZ TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 SEMICONDUCTOR AND CARRIER IN COMBINATION;The Greek character in the mark transliterates to MU, the accepted notation for the term micro.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. In an example embodiment, the semiconductor device comprises a carrier and a semiconductor element, such as an integrated circuit. The carrier is provided with apertures, thereby defining connecting conductors having side faces. Notches are present in the side faces. The semiconductor element is enclosed in an encapsulation that extends into the notches in the carrier. As a result, the encapsulation is mechanically anchored in the carrier. The semiconductor device can be made in a process wherein, after the encapsulating step, no lithographic steps are necessary.