PHYSICAL LAYER CIRCUIT

Brand	Owner	Address	Description
HDP	TranSwitch Corporation	3 Enterprise Drive Shelton CT 06484	Physical layer circuit, namely an interface circuit for use in high definition audio/video interface transmitters for transmitting high definition multimedia data using high definition cables and high speed digital links; Physical layer circuit, namely an interface circuit for use in high definition audio/video interface receivers for receiving high definition multimedia data using high definition cables and high speed digital links;HIGH DISPLAY PORT;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 ?m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.