MULTI DIE ELECTRONIC SUB ASSEMBLIES

Brand Owner Address Description
PYXIS TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 MULTI-DIE ELECTRONIC SUB-ASSEMBLIES, MULTI-CHIP MODULES, MULTI-CHIP PACKAGES AND INTEGRATED CIRCUITS ALL FOR USE AS COMPONENTS BY ELECTRONICS EQUIPMENT MANUFACTURERS TO ASSIST INFORMATION PROCESSING;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Electronic systems including Si/Ge substrates. The electronic systems can include data storage devices and/or logic devices having active regions extending into a crystalline Si/Ge material. An entirety of the portion of an active region within the crystalline Si/Ge material can be within a single crystal of the material. The assemblies can be utilized for detecting properties of objects, and in particular aspects can be incorporated into assemblies utilized for identifying persons. The assemblies can be fabricated over a range of versatile substrates, including, for example, glass, alumina or metal.