LAYER EMBOSSED PAPER

Brand Owner (click to sort) Address Description
ECO-CUSHION BROADWAY HOLDINGS IV 1 S. Middlesex Avenue Monroe Township NJ 08831 Layer of embossed paper and layers of embossed paper, paper, tissue paper, plastic films and plastic bags all used for wrapping and wrapping items for storage and moving;
ECO-POCKETS BROADWAY HOLDINGS IV 1 S. Middlesex Avenue Monroe Township NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags; all used for wrapping and for wrapping items for storage and moving;
ECO-POCKETS BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping items for storage and moving;
ECO-POCKETS BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping items for storage and moving;
ECO-POCKETS BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping breakable items for storage and moving;
ECO-POUCHES BROADWAY HOLDINGS IV 1 S. Middlesex Avenue Monroe Township NJ 08831 Layer of embossed paper and layers of embossed paper, paper, tissue paper, plastic films and plastic bags all used for wrapping and for wrapping items for storage and moving;
ECO-POUCHES BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper, paper, tissue paper, plastic films and plastic bags all used for wrapping and for wrapping items for storage and moving;
ECO-POUCHES BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper, paper, tissue paper, plastic films and plastic bags all used for wrapping and for wrapping items for storage and moving;
ECO-SHEETS BROADWAY HOLDINGS IV 1 S. Middlesex Avenue Monroe Township NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags all used for wrapping and for wrapping items for storage and moving;
ECO-SHEETS BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping items for storage and moving;
ECO-SHEETS BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping items for storage and moving;
ECO-SLEEVE BROADWAY HOLDINGS IV 1 S. Middlesex Avenue Monroe Township NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags; all used for wrapping and for wrapping items for storage and moving;
ECO-SLEEVE BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping items for storage and moving;
ECO-SLEEVE BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping items for storage and moving;
ECO-SLEEVE BROADWAY HOLDINGS IV 1 South Middlesex Ave Monroe NJ 08831 Layer of embossed paper and layers of embossed paper; paper; tissue paper; plastic films and plastic bags used for wrapping and for wrapping breakable items for storage and moving;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A semiconductor wafer with semiconductor chips having chip pads and a passivation layer is provided. First and second dielectric layers are sequentially formed on the passivation layer. The first and second dielectric layers form a ball pad area that includes an embossed portion, i.e., having a non-planar surface. A metal wiring layer is formed on the resulting structure including the embossed portion. A third dielectric layer is formed on the metal wiring layer. A portion of the third dielectric layer located on the embossed portion is removed to form a ball pad. A solder ball is formed on the embossed ball pad. With the embossed ball pad, the contact area between the solder balls and the metal wiring layer is increased, thereby improving the connection reliability.