HANDLING EQUIPMENT

Brand	Owner (click to sort)	Address	Description
CART BUDDY	Katy Distributing	12110 S. Lone Elm Road Olathe KS 66061	handling equipment, namely, metal framed hand truck with mounted motorized wench for moving personal watercraft from one trailer or cart to another cart;Cart;
CRETER CRANE	ROTEC INDUSTRIES, INC.	333 WEST LAKE ST. ELMHURST IL 60126	handling equipment, namely, concrete and aggregate material conveyors;CRANE;
KMP	KUKA DEUTSCHLAND GMBH	Zugspitzstr. 140 Augsburg D-86165 Germany	Handling equipment, in particular linear guide and ranging units being machines for moving objects, linear motion units being machines for moving objects, traversing axes being machines for moving objects, and conveyor belts; structural parts and accessories of the above-mentioned goods; conveyances for non-personal transport, in particular, linear transporting, elevating or lifting movable work platforms, including mobile work platforms, all being machines for moving objects;Land vehicles; Robotic transport vehicles; Self-driving land vehicles; Self-driving robotic transport vehicles; Remote controlled land vehicles; Remote controlled robotic transport vehicles; and structural parts therefor;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Automated defect sourcing system identifies root-causes of yield excursion due to contamination, process faults, equipment failure and/or handling in timely manner and provides accurate timely feedback to address and contain the sources of yield excursion. A signature bank stores known wafer surface manufacturing defects as defect signatures. The signature of a manufacturing defect pattern is associated with a type of equipment or process, and used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature recognition engine matches wafer defects against the signature bank during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.